Variable resistive memory wordline switch

ABSTRACT

A variable resistive memory device includes a main wordline, a wordline connecting switch in signal communication with the main wordline, a sub-wordline in signal communication with the wordline connecting switch, and a variable resistive memory cell having a variable resistance in signal communication with a first terminal of a switching element, a second terminal of the switching element disposed in signal communication with the sub-wordline; and a method of controlling the voltage of a sub-wordline in a variable resistive memory device includes switchably passing a voltage from a main wordline to the sub-wordline, and substantially blocking forward current flow from the sub-wordline to a variable resistive memory cell of the device.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims foreign priority under 35 U.S.C. § 119 to KoreanPatent Application No. P2006-0097008, filed on Oct. 2, 2006, in theKorean Intellectual Property Office the disclosure of which isincorporated by reference herein in its entirety,

BACKGROUND OF THE INVENTION

The present invention relates to variable resistive memory devices, andmore particularly to variable resistive memory devices havinghierarchical wordline structures. As the demand for both high densityand low power consumption continues to increase, a new generation ofmemory devices has emerged. The new generation of memory devicesincludes both nonvolatile characteristics for low power consumption andeasy scalability for high density, There have been three basic types ofthe new generation memory devices, including Phase change Random AccessMemory (PRAM), Resistive Random Access Memory (RRAM) and Magnetic RandomAccess Memory (MRAM).

As shown in FIG. 1, a unit memory cell for a memory device is indicatedgenerally by the reference numeral 100. The unit memory cell 100 has avariable resistive material part 110 connected to a switching element112, such as a transistor or a diode. Here, the variable resistivematerial part 110 and the switching element 112 are connected in seriesbetween a bitline BL and a wordline WL. In accordance with theparticular characteristics of the variable resistive material part 110,the memory device may be one of PRAM, RRAM or MRAM. If the variableresistive material part 110 includes an upper electrode, a lowerelectrode, and phase change material between the upper and lowerelectrodes, the memory device may be classified as PRAM. If the variableresistive material part is made of upper and lower electrodes with aComplex Metal Oxide (COMO) between them, the memory device may beclassified as RRAM. If the variable resistive material part is made ofupper and lower electrodes, where the upper electrode is magnetic, withan insulating material between the electrodes, the memory device may beclassified as MRAM.

A common characteristic of the three basic types of new generationmemory devices is that a current flows from a bitline BL to a wordlineWL, or vice versa, when a write operation or a read operation occurs.For simplicity of explanation, the description that follows assumes thatthe variable resistive material is a phase change material, but it shallbe understood that the present disclosure extends to all types of newgeneration memory devices.

Turning to FIG. 2, a memory array or device 200 includes a plurality ofunit memory cells 100 as described with respect to FIG. 1, The memoryarray 200 includes a row decoder and main wordline (MWL) driver 210connected to memory blocks BLK0 through BLKn, main wordlines MWL_0through MWL_I connected to each MWL driver respectively, sub wordline(SWL) drivers 220 each connected to one of the main wordlines MWL_0through MWL_I, sub wordlines SWL each connected to sub wordline driversof a main wordline, and bitlines BL in each memory block that connectthrough memory cells to the sub wordlines, Each sub wordline driver islocated among the memory blocks and supplies appropriate voltage to thecorresponding sub wordline in response to the main wordline voltage. Thesub wordline drivers are of the inverter type, including a PMOStransistor 222 and an NMOS transistor 224. The PMOS 222 supplies highvoltage to the sub wordline and the NMOS 224 supplies low voltage to thesub wordline.

Because each sub wordline driver has both PMOS and NMOS transistors, thelayout for the sub wordline driver includes a well region to isolateeach PMOS transistor from the corresponding NMOS transistor. Thus, thelayout area for each sub wordline driver with well regions introduces aconstraint on the minimum size for reducing the size of the memory array200. In addition, because the voltage of a main wordline is differentfrom that of sub wordline, if the main wordline and sub wordline becameelectrically shorted, such as due to a process problem, for example,repair may be difficult.

SUMMARY OF THE INVENTION

These and other issues are addressed by a variable resistive memorywordline switch and related methods. Exemplary embodiments are provided.

An exemplary variable resistive memory device includes a main wordline,a wordline connecting switch in signal communication with the mainwordline, a sub-wordline in signal communication with the wordlineconnecting switch, and a variable resistive memory cell having avariable resistance in signal communication with a first terminal of aswitching element, a second terminal of the switching element disposedin signal communication with the sub-wordline.

Another exemplary variable resistive memory device includes a mainwordline, a wordline connecting switch in signal communication with themain wordline, a sub-wordline in signal communication with the wordlineconnecting switch, a variable resistive memory cell having a variableresistor in signal communication with a first terminal of a switchingelement, a second terminal of the switching element disposed in signalcommunication with the sub-wordline, a sub-wordline pre-charging switchin signal communication with the sub-wordline a pre-charge voltageselector in signal communication with the sub-wordline pre-chargingswitch where the pre-charge voltage selector having a first switch insignal communication with a first voltage greater than a write voltageand a second switch in signal communication with a second voltage lessthan the first voltage and greater than a read voltage and a prechargedisabling switch disposed between the pre-charge voltage selector andthe subwordline pre-charging switch for disabling pre-charging ofsub-wordlines.

An exemplary method of controlling the voltage of a sub-wordline in avariable resistive memory device includes switchably passing a voltagefrom a m main wordline to the sub-wordline, and substantially blockingforward current flow from the sub-wordline to a variable resistivememory cell of the device.

The present disclosure will be further understood from the followingdescription of exemplary embodiments, which is to be read in connectionwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure provides a variable resistive memory wordlineswitch and related method in accordance with the following exemplaryfigures, in which:

FIG. 1 shows a schematic circuit diagram for a unit memory cell, whichis provided as background material,

FIG. 2 shows a schematic diagram for a memory device, which is providedas background material,

FIG. 3 shows a schematic diagram for a memory device in accordance withan exemplary embodiment of the present disclosure;

FIG. 4 shows a schematic circuit diagram for a wordline switch of amemory device in accordance with FIG. 3;

FIG. 5 shows a timing diagram for a memory device having a wordlineswitch in accordance with FIG. 4;

FIG. 6 shows a schematic circuit diagram for another wordline switch ofa memory device in accordance with an exemplary embodiment of thepresent disclosure.

FIG. 7 shows a timing diagram for a memory device having a wordlineswitch in accordance with FIG. 6;

FIG. 8 shows a schematic circuit diagram for a memory device having awordline connecting part, pre-charging part and voltage switching partin accordance with an exemplary embodiment of the present disclosure;

FIG. 9 shows a schematic circuit diagram for a circuit including avoltage switching part and a main wordline driver in accordance withFIG. 8;

FIG. 10 shows a schematic circuit diagram for a memory device having acontrol switch in accordance with an exemplary embodiment of the presentdisclosure, and

FIG. 11 shows a schematic circuit diagram for a memory device havingdischarging transistors and a precharging transistor in accordance withan exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Exemplary embodiments of the present disclosure may reduce layout sizeby connecting a main wordline to a sub wordline with only one switchingelement, such as one transistor. In addition, the voltage of a mainwordline may have substantially the same voltage as an associated subwordline, which secures read and write operations. To preventdisturbances to non-selected memory cells, non-selected sub wordlineshave a first boosting voltage when a write operation occurs and a secondboosting voltage when a read operation occurs.

Turning now to FIG. 3, a memory device in accordance with an exemplaryembodiment of the present disclosure is indicated generally by thereference numeral 300. The memory device 300 includes a plurality ofmemory banks, BANK0 through BANKS, a row decoder and main wordlinedriver unit 310, and a column decoder and data in/out circuits unit 320.Each memory bank includes a plurality of memory sectors SEC1 throughSEC7, each of which has a plurality of memory blocks BLK0 through BLKS.

In operation, the row decoder and main wordline driver unit 310 selectsa main wordline and supplies an appropriate voltage to it. The columndecoder and data in/out circuits unit 320 selects a bitline in eachmemory block and writes data to a memory cell and/or reads data from amemory cell.

Memory sector SEC7 in BANK3 will now be explained in detail, It shall beunderstood that the other sectors in this bank and in the other memorybanks have comparable structures. Thus, duplicate description isomitted. SEC7 includes memory blocks BLK0, BLK1 BLK2 and BLK3, andwordline connecting pads 330 connected between each SWL andcorresponding MWL in each block. That is a MWL is formed over the SEC7and a SWL is connected together in each memory block. Each memory blockhas memory cells, which may be the same as d described with respect toFIG. 1. Each wordline connecting part 330 is formed among the memoryblocks and includes only an NMOS transistor. That is, there is nocorresponding PMOS transistor. A gate of the NMOS transistor isconnected to a sub wordline selection signal (SA), a drain of the NMOStransistor is connected to the MWL, and a source of NMOS transistor isconnected to the SWL.

In alternate embodiments, the NMOS transistors may be completelyreplaced with PMOS transistors. That is, the memory device 300 accordingto the present disclosure has a wordline connection part 330 comprisingonly one transistor, so that layout size can be smaller than the memorydevice 200 of FIG. 2, for example,

For example, the variable resistive memory device 300 includes a mainwordline, a wordline connecting switch in signal communication with themain wordline in response to a sub-wordline selection signal, asub-wordline in signal communication with the wordline connectingswitch, and a variable resistive memory cell having a variableresistance in signal communication with a first terminal of a switchingelement, a second terminal of the switching element disposed in signalcommunication with the sub-wordline.

As shown in FIG. 4, a circuit for a wordline connecting part or switchis indicated generally by the reference numeral 400. The circuit 400includes a wordline connecting part 410 for connecting a MWL to one ormore SWLs. The circuit 400 represents an exemplary hierarchical wordlinestructure where one main wordline is connected to four sub wordlines.The four sub wordlines are merely exemplary, and it shall be understoodthat the number of sub wordlines assigned to one main wordline may beadjusted in alternate embodiments.

The wordline connecting part 410 is located between memory blocks, herebetween BLK1 and BLK2, and has four NMOS transistors 412. Eachtransistor has a gate connecting to a corresponding one of four subwordline selection signals, SA00 through SA11, a drain connecting to theMSWL and a source connecting to a corresponding one of the sub wordlinesSWL0 through SWL3. In addition, each sub wordline is connected to thecathode end of a diode of a memory cell such as the cell 100 of FIG. 1.Thus, write current or read current flows to a sub wordline when a writeoperation or a read operation occurs, respectively.

For example, the variable resistive memory device 300 of FIG. 3 can bemodified to include at least a second wordline connecting switch insignal communication with the main wordline, at least a secondsub-wordline in signal communication with the second wordline connectingswitch, and a sub-wordline selection signal generator in signalcommunication with a control input of each of the first and secondwordline connecting switches.

Turning to FIG. 5, a timing diagram for a memory device having thewordline connecting part 410 of FIG. 4 is indicated generally by thereference numeral 500. In the diagram 500, it is assumed that the SWL0is activated. Here, /CE is a chip enable, /WE is a write enable, and SAis a sub wordline selection signal. The dotted line portions areindicative of non-selected lines. The solid line portions are indicativeof the selected line.

In standby mode, all MWLs stay at a first voltage (VPP), which may beobtained by boosting VAC. In addition, all SAs stay at a second voltage(VPP+Vt), so that all SWLs have the first voltage through transistors N0through N3. The diodes in the memory cells are in a reverse bias state,so current through the variable resistive material does not flow in thestandby mode.

In a write operation, when /CE and /WE go to low, the write operationstarts. The row decoder selects one MWL and the main wordline driverdrives the one selected MWL to get VSS from the first voltage. Thenon-selected MWLs still have the first voltage. In addition, one of thesub word selection signals SA00 still has the second voltage and theothers, namely SA01 SA10 and SA11, drive to have VSS from the secondvoltage. Thus, only the N0 transistor turns on and VSS of the selectedMWL can be transferred to SWL0, Due to the voltage difference betweenthe data voltage of bitline delivered through the data in/out circuitsand the VSS of the selected SWL0, the write current flows through thevariable resistive material from the bitline to SWL0, During the writeoperation, the non-selected SWL is in a floating state, If the voltagedifference between the bitline and the non-selected SWL can stay below abuilt in potential (Vbi) of the diode of the memory cell, currentthrough non-selected memory cell does not flow in the write operation.The timing diagram 500 is similarly applicable when a read operationoccurs.

Turning now to FIG. 6, a wordline connecting part or switch according toanother embodiment of the present disclosure is indicated generally bythe reference numeral 600. The wordline connecting part or switch 600includes a pre-charging part 620, where VPP_SWLP is a sub wordlinepre-charge voltage. A memory device further includes the pre-chargingpart 620 to prevent a floating state of non-selected SWLs while a writeoperation or a read operation occurs. A memory block BLK is disposedbetween the pre-charging parts 620. The pre-charging part has aplurality of transistors, N5 through N8, each of which has a gateconnecting to corresponding one of the pre-charging signals PS00 throughPS11, a drain connecting to the sub wordline pre-charge voltage(VPP_SWLP) and a source connecting to a corresponding one of the subwordlines.

The VPP_SWLP may be same level as the first voltage VPP. Thepre-charging signals PS00 through PS11 are inverted signals of subwordline selection signals SA00 through SA11 generated by inverters. Theinverters may be located in the row decoder and main wordline driver. Inaddition the pre-charging part can comprise only PMOS transistorsinstead of NMOS transistors. In this case, the sub wordline selectionsignal is directly connected to the gate of PMOS transistors. Inaddition, N4 and N6 are located towards the left side of the memoryblock and pre-charge SWL0 and SWL2 respectively, in response to thecorresponding pre-charging signal. N5 and N7 are located towards theright side of the memory block and pre-charge SWL1 and SWL3,respectively, in response to the corresponding pre-charging signal. Thismethod can be used to minimize the required size for the pre-chargingpart. Thus, the pre-charging part can pre-charge non-selected SWLs asVPP_SWLP white a write or a read operation occurs.

For example, the variable resistive memory device 400 of FIG. 4 can bemodified to include at least one sub-wordline pro-charging switch insignal communication with the sub-wordline.

As shown in FIG. 7, a timing diagram for a memory device including thewordline connecting part 600 of FIG. 6 is indicated generally by thereference numeral 700, in the diagram 700, it is assumed that SWL0 hasbeen activated. Here, /CE is a chip enable, /WE is a write enable, SA isa sub wordline selection signal, and PS is a pre-charging signal. Dottedlines are indicative of non-selected lines. Solid lines are indicativeof a selected line.

In standby mode, all MWL stay at first voltage VPP, which may beobtained by boosting VCC. All SA stay at VSS, and pre-charging signalsPS00 through PS11 stay at VPP_SWLP plus Vt, so that all SWLs have theVPP_SWLP through the respective transistors N4 through N7. The diodes inthe memory cells are in a reverse bias state, so current through theresistive variable material does not flow in the standby mode.

In a write operation when /CE and /WE go to low the write operationstarts, The row decoder selects one MWL and the main wordline driverdrives the one MWL to get VSS from the first voltage. The non-selectedMWLs still have the first voltage, In addition, one of the sub wordselection signals, such as SA00 drives to have VPP+Vt and the othershave VSS. Thus, only the N0 transistor turns on, and VSS of the selectedMVL can be transferred to SWL0. Further, only N4 in the pre-chargingpart turns off by the “low” of PS00 and the other transistors in thepre-charging part remain on, so that non selected SVLs can stay as VPP_SWLP. Due to the voltage difference between the data voltage of thebitline delivered by the data in/out circuits and VSS of the selectedSWL0, the write current flows through the variable resistive materialfrom the bitline to SWL0.

The timing diagram 700 is similarly applicable when a read operationoccurs. A write voltage applied to the bitline when a write operationoccurs is different from a read voltage applied to the bitline when aread operation occurs, in that the write voltage is larger than the readvoltage.

Turning to FIG. 8, a memory device having a wordline connecting part,pre-charging part and voltage switching part according to anotherembodiment of the present disclosure is indicated generally by thereference numeral 800. Referring back to FIG. 6, the memory device 600has only one sub wordline pre-charge voltage VPP_SWLP. VPP_SWLP islarger than the write voltage so as to sustain reverse bias of a diodebetween a non-selected SWL and the bitline. In addition, VPP_SWLP can begenerated by boosting VCC. VPP_SWLP is determined by the write voltageof the bitline to prevent disturbing non-selected memory cells. If apre-charging voltage of the non-selected sub wordline can be controlledin response to write operations versus read operations power consumptionof memory device can be further reduced.

The memory device 800 of FIG. 8 includes a pre-charging part 810, apre-charge voltage selector or voltage switching part 820, and a mainwordline driver 830. Thus, the memory device 800 differs from the memorydevice 600 of FIG. 6 in that it has the voltage switching part 820. Thevoltage switching part 820 includes a first switch S0 responsive to awrite signal /WR, and a second switch S1 responsive to a read signal RDor a standby signal STY. The first switch S0 supplies a first boostingvoltage VPP_WR to a main wordline driver and to the pre-charging part810 during a write operation. The second switch Si supplies a secondboosting voltage VPP_RD to the main wordline driver and to thepre-charging part 810 during a read operation. Here, VPP_WR is largerthan VPP_RD. Thus, because the memory device 800 uses VPP_WR and VPP_RDselectively according to whether a write operation or a read operationis executed, power consumption can be further reduced.

For example, the variable resistive memory device 600 of FIG. 6 can bemodified to include a pre-charge voltage selector in signalcommunication with the sub-wordline pre-charging switch, the pre-chargevoltage selector having a first selector switch in signal communicationwith a first voltage greater than a write voltage, and a second selectorswitch in signal communication with a second voltage less than the firstvoltage and greater than a read voltage.

Turning now to FIG. 9 a circuit including a voltage switching part and amain wordline driver is indicated generally by the reference numeral900, The circuit 900 may be used in the memory device 800 of FIG. 8, forexample. The circuit 900 includes a pre-charge voltage selector orvoltage switching part 820, a main wordline driver 830 that includes acontrol part 831 and a driving part 832, Here, VPP_WR is a firstboosting voltage for a write operation, VPP_RD is a second boostingvoltage for a read operation. /WR is a signal indicating a writeoperation, RD is a signal indicating a read operation, VPP_SWLP isconnected to the pre-charging part. /MWLS is a main wordline selectionsignal, As used herein, the “I” means that the signal is activated by anegative logic value.

Here, the main wordline driver 830 includes the control part 831 and thedriving part 832, The control part includes first PMOS and NMOStransistors, and the driving part includes second PMOS and NMOStransistors,

In the control part 831, the first PMOS transistor has a sourceconnected to the pre-charge voltage selector 820, a gate connected to/MWLS, and a drain connected to a shared terminal. The first NMOStransistor has a drain connected to the shared terminal, a gateconnected to /MWLS, and a source connected to ground.

In the driving part 832, the second PMQS has a gate connected to theshared terminal, a source connected to the pre-charge voltage selector820, and a drain connected to the MWL. The second NMOS has a gateconnected to the shared terminal, a drain connected to the MWL, and asource connected to ground.

Table 1 shows signal states for the circuits 800 and 900 according tooperating conditions.

TABLE 1 Voltage of Voltage of STB RD /WR /MWLS MWL SWL Standby H L H HVPP_RD VPP_RD Read L H H Selected L VSS VSS operation Non H VPP_RDVPP_RD selected Write L L L Selected L VSS VSS operation Non H VPP_WRVPP_WR selected

Thus, in a standby mode, all MWL and all SWL have VPP_RD. For a readoperation, the selected MWL has VSS and selected SWL has VSS, butnon-selected MWL and non-selected SWL have VPP_RD. For a writeoperation, the selected MWL has VSS and the selected SWL has VSS, butnon-selected MWL and non-selected SWL have VPP_WR.

As shown in FIG. 10, a memory device having a control switch isindicated generally by the reference numeral 1000. The memory device1000 has a control switch 840 to enable or disable the pre-charging partaccording to this embodiment of the present disclosure, The controlswitch may be controlled by Mode Register Set (MRS) to enable thepre-charging part Otherwise, the memory device 1000 is similar to thememory device 800 of FIG. 8, so duplicate description is omitted.

For example, a variable resistive memory device can include a mainwordline, a wordline connecting switch in signal communication with themain wordline, a sub-wordline in signal communication with the wordlineconnecting switch, a variable resistive memory cell having a variableresistor in signal communication with a first terminal of a switchingelement, a second terminal of the switching element disposed in signalcommunication with the sub-wordline, a sub-wordline pre-charging switchin signal communication with the sub-wordline, a pre-charge voltageselector in signal communication with the sub-wordline pre-chargingswitch, the pre-charge voltage selector having a first switch in signalcommunication with a first voltage greater than a write voltage, and asecond switch in signal communication with a second voltage less thanthe first voltage and greater than a read voltage, and a pre-chargedisabling switch disposed between the pre-charge voltage selector andthe sub-wordline pre-charging switch for disabling pre-charging ofsub-wordlines.

Turning to FIG. 11, another exemplary embodiment memory device isindicated generally by the reference numeral 1100. The memory device1100 has a discharging switch or transistor 1140 in each wordlineconnecting part and a main wordline pre-charging switch or transistor1150 The main wordline pre-charging switch or transistor 1150 isdisposed between the voltage switching part 820 and the MWL, with acontrol input or gate in signal communication with a switch driver 1130for the MWLS signal. The discharging switches or transistors 1140 areeach disposed relative to the wordline connecting parts 410 andconnected between the MWL and ground with a control input or gate insignal communication with the switch driver 1130. Otherwise, the memorydevice 100 is similar to the memory device 1000 of FIG. 10, so duplicatedescription is omitted.

If the main wordline has a large resistance, discharging the mainwordline to VSS from VPP_WR or VPP_RD may take too much time. Thus, thetime required for discharge may constrain high-speed operation.Therefore, the memory circuit 1100 provides exemplary transistorsconstructed as the discharging transistors 1140 and the pre-chargingtransistor 1150.

Table 2 shows signal states for the circuit 1100 according to operatingconditions.

TABLE 2 SA PS Voltage of MWL Voltage of SWL Standby L H VPP_RD VPP_RDRead Selected H L VSS VSS operation Non selected L H VPP_RD VPP_RD WriteSelected H L VSS VSS operation Non selected L H VPP_WR VPP_WR

As indicated in Table 2, each PS signal corresponds to an inverted SAsignal. When a PS signal is High, a VPP voltage level corresponding to aRD or a WR operation, respectively, is substantially conducted from aMWL to a SWL.

Referring back to FIGS. 8 through 11, SA signals SA00 SA01 SA10 and SA11are inverted to obtain PS signals PS00, PS01, PS10 and PS11,respectively. The PS signals PS00, PS01 PS10 and PS11, in turn, areapplied to the gates of the transistors connecting the appropriate VPPvoltage level to the sub-wordlines SWL0, SWL1, SWL2 and SWL3,respectively.

For example, the variable resistive memory device 1000 of FIG. 10 may bemodified to include a switch driver, a main wordline pre-charging switchconnected between the pre-charge voltage selector and the main wordlinewith a control input in signal communication with the switch driver, andat least one discharging switch connected between the main wordline andground with a control input in signal communication with the switchdriver.

Although illustrative embodiments have been described herein withreference to the accompanying drawings, it is to be understood that thepresent disclosure is not limited to those precise embodiments, and thatvarious other changes and modifications may be effected therein by thoseof ordinary skill in the pertinent art without departing from the scopeor spirit of the present disclosure. All such changes and modificationsare intended to be included within the scope of the present disclosureas set forth in the appended claims.

1. A variable resistive random-access memory (RAM) device, comprising: amain wordline; a wordline connecting switch in signal communication withthe main wordline; a sub-wordline in signal communication with thewordline connecting switch; a variable resistive memory cell having avariable resistance in signal communication with a first terminal of aswitching element, a second terminal of the switching element disposedin signal communication with the sub-wordline; a sub-word linepre-charging switch in signal communication with the sub-wordline; and apre-charge voltage selector in signal communication with thesub-wordline pre-charging switch, the pre-charge voltage selector havinga first selector switch in signal communication with a first voltagegreater than a write voltage, and a second selector switch in signalcommunication with a second voltage less than the first voltage.
 2. Adevice as defined in claim 1 wherein the wordline connecting switch is asingle transistor.
 3. A device as defined in claim 2 wherein the singletransistor is NMOS.
 4. A device as defined in claim 1, furthercomprising: a second word line connecting switch in signal communicationwith the main wordline; a second sub-wordline in signal communicationwith the second wordline connecting switch; and a sub-wordline selectionsignal generator in signal communication with a control input of each ofthe first and second wordline connecting switches.
 5. A device asdefined in claim 4 wherein the first sub-wordline is selected and thesecond sub-word line is non-selected by the sub-word line selectionsignal generator, which opens the word line connecting switch for thenon-selected second sub-wordline during a read or a write operation. 6.A device as defined in claim 5 wherein the first and second wordlineconnecting switches are closed and the main wordline has substantiallythe same voltage potential as the first and second sub-wordlines in astandby mode.
 7. A device as defined in claim 4 wherein the firstsub-wordline is selected and the second sub-wordline is non-selected bythe sub-wordline selection signal generator, which closes the wordlineconnecting switch for the selected second sub-wordline during a read ora write operation.
 8. A device as defined in claim 1 wherein a controlinput of the sub-wordline pre-charging switch is in inverted signalcommunication with a control input of the wordline connecting switch. 9.A device as defined in claim 1, further comprising a main wordlinepre-charging transistor in signal communication with the main wordline.10. A device as defined in claim 1, further comprising a main wordlinedischarging transistor in signal communication with the main wordline.11. A variable resistive memory device, comprising: a main word linehaving a voltage; a wordline connecting switch in signal communicationwith the main wordline; a sub-wordline having the voltage in signalcommunication with the wordline connecting switch; a variable resistivememory cell having a variable resistance in signal communication with afirst terminal of a switching element, a second terminal of theswitching element disposed in signal communication with thesub-wordline; a sub-wordline pre-charging switch in signal communicationwith the sub-wordline; and a pre-charge voltage selector in signalcommunication with the sub-wordline pre-charging switch, the pre-chargevoltage selector having a first selector switch in signal communicationwith a first voltage greater than a write voltage, and a second selectorswitch in signal communication with a second voltage less than the firstvoltage and greater than a read voltage.
 12. A device as defined inclaim 11, further comprising a NOR gate in signal communication with acontrol input of the second selector switch, the NOR gate having a firstinput for receiving an input indicative of a read signal and a secondinput for receiving an input indicative of a standby signal.
 13. Adevice as defined in claim 11, further comprising a main wordline driverin signal communication between the pre-charge voltage selector and themain wordline for driving the main wordline to one of the voltagesselected by the pre-charge voltage selector.
 14. A device as defined inclaim 13, the main wordline driver comprising: a first PMOS transistorhaving a source connected to the pre-charge voltage selector, a gateconnected to a signal line indicative of main wordline selection, and adrain connected to a shared terminal; a first NMOS transistor having adrain connected to the shared terminal, a gate connected to the signalline indicative of main word line selection, and a source connected toground; a second PMOS having a gate connected to the shared terminal, asource connected to the pre-charge voltage selector, and a drainconnected to the main wordline; and the second NMOS having a gateconnected to the shared terminal, a drain connected to the mainwordline, and a source connected to ground.
 15. A variable resistivememory device, comprising: a main wordline; a wordline connecting switchin signal communication with the main wordline; a sub-wordline in signalcommunication with the wordline connecting switch; a variable resistivememory cell having a variable resistor in signal communication with afirst terminal of a switching element, a second terminal of theswitching element disposed in signal communication with thesub-wordline; a sub-wordline pre-charging switch in signal communicationwith the sub-wordline; a pre-charge voltage selector in signalcommunication with the sub-wordline pre-charging switch, the pre-chargevoltage selector having a first switch in signal communication with afirst voltage greater than a write voltage, and a second switch insignal communication with a second voltage less than the first voltageand greater than a read voltage; and a pre-charge disabling switchdisposed between the pre-charge voltage selector and the sub-wordlinepre-charging switch for disabling pre-charging of sub-wordlines.
 16. Avariable resistive memory device as defined in claim 15, furthercomprising: a switch driver; a main word line pre-charging switchconnected between the pre-charge voltage selector and the main wordlinewith a control input in signal communication with the switch driver; andat least one discharging switch connected between the main word line andground with a control input in signal communication with the switchdriver.